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product structure silicon monolithic integrated circuit. this product is not designed for pr otection against radioactive rays. 1/28 tsz02201-0j3j0aj00650-1-2 ? 2015 rohm co., ltd. all rights reserved. 13.feb.2015 rev.002 www.rohm.com tsz22111 ? 14 ? 001 datashee t 7.0v to 36v input, 3.0a integrated mosfet single synchronous buck dc/dc converter bd9e303efj-lb general description this is the product guarantees long time support in industrial market.bd9e303efj-lb is a synchronous buck switching regulator with built -in power mosfets. it is a current mode control dc/dc converter and features high-speed transient response. phase compensation can also be set easily. features ? long time support product for industrial applications. ? synchronous single dc/dc converter. ? over-current protection. ? short circuit protection. ? thermal shutdown protection. ? under voltage lockout protection. ? soft start. ? htsop-j8 package (exposed pad). applications ? industrial equipment. ? power supply for fas industrial device using 24v bass. ? consumer applications such as home appliance. distribution type power supply system for 12v, and 24v. key specifications ? input voltage range: 7.0v to 36v ? output voltage range: 1.0v to v in 0.8v ? output current: 3.0a (max) ? switching frequency: 300khz (typ) ? high-side mosfet on-resistance: 90m ? (typ) ? low-side mosfet on-resistance: 80m ? (typ) ? standby current: 0 a (typ) package w (typ) x d (typ) x h (max) htsop-j8 4.90mm x 6.00mm x 1.00mm typical application circuit figure 1. application circuit htsop-j8 2 3 6 4 7 5 1 8 vin 24v enable vinen comp agnd pgnd fb sw boot 10 f 15k 6800pf 30k 7.5k 0.1 f 10 h 22 f2 bd9e303efj-lb vout 0.1 f downloaded from: http:///
2/28 datasheet d a t a s h e e t bd9e303efj-lb tsz02201-0j3j0aj00650-1-2 ? 2015 rohm co., ltd. all rights reserved. 13.feb.2015 rev.002 www.rohm.com tsz22111 ? 15 ? 001 pin configuration pin description(s) pin no pin name description 1 boot connect a bootstrap capacitor of 0.1f between this terminal and sw terminal. the voltage of this capacitor is the gate drive voltage of the high-side mosfet. 2 vin power supply terminal for the switching regulator and control circuit. connecting a 10f and 0.1f ceramic capacitor is recommended. 3 en turning this terminal signal low-level (0.8v or lower) forces the device to enter the shut down mode. turning this terminal signal high-level (2.5v or higher) enables the device. this terminal must be terminated. 4 agnd ground terminal for the control circuit. 5 fb inverting input node for the gm error amplifier. see page 18 on how to calculate the resistance of the output voltage setting. 6 comp output of gm error amplifier, and in put of pwm comparator. connect phase compensation components to this pin. see page 20 on how to calculate the resistance and capacitance for phase compensation. 7 pgnd ground terminal for the output st age of the switching regulator. 8 sw switch node. this terminal is connected to the source of the high-side mosfet and drain of the low-side mosfet. connect a bootstrap capacitor of 0.1f between this terminal and boot terminal. in addition, connect an inductor considering the direct current superimposition characteristic. - e-pad exposed pad. connecting this to the inte rnal pcb ground plane using multiple vias provides excellent heat dissipation characteristics. figure 2. pin assignment sw pgnd fb b oo t vin en agnd comp 7 8 6 5 3 4 2 1 (top view) e-pad downloaded from: http:///
3/28 datasheet d a t a s h e e t bd9e303efj-lb tsz02201-0j3j0aj00650-1-2 ? 2015 rohm co., ltd. all rights reserved. 13.feb.2015 rev.002 www.rohm.com tsz22111 ? 15 ? 001 block diagram figure 3. block diagram i i i i downloaded from: http:///
4/28 datasheet d a t a s h e e t bd9e303efj-lb tsz02201-0j3j0aj00650-1-2 ? 2015 rohm co., ltd. all rights reserved. 13.feb.2015 rev.002 www.rohm.com tsz22111 ? 15 ? 001 description of block ? vreg3 block creating internal reference voltage 3v (typ). ? vreg block creating internal reference voltage 5v (typ). ? bootreg block creating gate drive voltage. ? tsd this is the thermal shutdown block. thermal shutdown circuit shuts down the whole system if temperature exceeds 175c (typ). when the temperature decreases, it returns to normal operation with hyst eresis of 25c (typ). ? uvlo this is the under voltage lock-out block. ic shuts down when vin is under 5v (typ). the threshold voltage has a hysteresis of 1.4v (typ). ? err this circuit compares the feedback voltage at the output to the reference voltage. t he output of this circuit is the comp terminal voltage and this determines the switching duty. also, because of soft start during start-up, comp terminal voltage is controlled by internal slope voltage. ? osc block generating oscillation frequency. ? slope this circuit creates a triangular wave from generated clock in osc. the voltage converted from current sense signal of high side mosfet and the triangular wave is sent to pwm comparator. ? pwm this block determines the switching duty by comparing the out put comp terminal voltage of error amplifier and output of slope block. ? driver logic this is the dc/dc driver block. i nput to this block is signal from pwm and output drives the mosfets. ? soft start this circuit prevents the overshoot of outpu t voltage and in-rush current by forcing the output voltage to rise slowly, thus, avoiding surges in current during start-up. ? ocp this block limits the current flowing in high side mosfet for each cycle of switching frequency during over-current. ? rcp this block limits the current flowing in low side mosfet for each cycle of switching frequency during over-current. ? scp the short circuit protection block compares the fb terminal voltage with the internal standard voltage vref. when the fb terminal voltage has fallen below 0.7v (typ) and remained in that state for 1.0msec (typ), scp activates and stops the operation for 14msec (typ) and subsequently initiates a restart. ? ovp over voltage protection function (ovp) compares fb terminal voltage with the internal standard voltage vref. when the fb terminal voltage exceeds 1.30v (typ) it turns mosfet of out put part mosfet off. after output voltage drop it returns with hysteresis. downloaded from: http:///
5/28 datasheet d a t a s h e e t bd9e303efj-lb tsz02201-0j3j0aj00650-1-2 ? 2015 rohm co., ltd. all rights reserved. 13.feb.2015 rev.002 www.rohm.com tsz22111 ? 15 ? 001 absolute maximum ratings (ta = 25c) parameter symbol rating unit supply voltage v in -0.3 to +40 v en input voltage v en -0.3 to +40 v voltage from gnd to boot v boot -0.3 to +45 v voltage from sw to boot ? v boot -0.3 to +7 v fb input voltage v fb -0.3 to +7 v comp input voltage v comp -0.3 to +7 v sw input voltage v sw -0.5 to vin + 0.3 v allowable power dissipation (note 1) pd 2.76 (note 1) w operating junction temperature range tj -40 to +150 ? c storage temperature range tstg -55 to +150 ? c (note 1) htsop-j8:derating in done 22mw/c for operating ta 25c (pcb size: 114.3 mm 76.2 mm 1.6 mm, c opper foil area (on 2nd & 3rd layer and reverse side): 74.2 mm 74.2 mm when mounted on 4-layer pcb) copper foil thickness: front side and reverse side 70m be used, 2nd & 3rd 35m be used. caution1: operating the ic over the absolute maximum ratings may damage the ic. the damage can either be a short circuit between pins or an open circuit between pins and the internal circuitry. therefore, it is import ant to consider circuit protection measures, such as adding a f use, in case the ic is operated over the absolute maximum ratings. caution2: reliability is decreased at junction temperature greater than 125 ? c. recommended operating conditions (ta= -40c to +85c) parameter symbol rating unit min typ max supply voltage v in 7.0 - 36 v output current i out 0 - 3 a output voltage range v range 1.0 (note 2) - v in 0.8 v (note 2) please use it in output voltage setting of which output pulse width does not become 200nsec (typ) or less. see the pag e 18 for how to calculate the resistance of the output voltage setting. electrical characteristics (unless otherwise specified v in =24v v en =3v ta=25c) parameter symbol limit unit conditions min typ max supply current in operating i opr - 2.2 3.0 ma v fb = 1.1v no switching supply current in standby i stby - 0 10 a v en = 0v reference voltage (t j =25c) v fb 0.990 1.000 1.010 v reference voltage (t j =-40 to +150c) v fb 0.965 1.000 1.035 v fb input current i fb -1 0 1 a v fb = 1.1v switching frequency f osc 255 300 345 khz maximum duty ratio m axduty 90 95 99 % high-side fet on-resistance r onh - 90 - m ? i sw = 100ma low-side fet on-resistance r onl - 80 - m ? i sw = 100ma over current limit i limit - 5.2 - a uvlo detection voltage v uvlo 4.7 5.0 5.3 v v in falling uvlo hysteresis voltage v uvlohys 1.2 1.4 1.6 v en high-level input voltage v enh 2.5 - v in v en low-level input voltage v enl 0 - 0.8 v en input current i en 2.1 4.2 8.4 a v en = 3v soft start time t ss 1.25 2.50 5.00 msec en rising to fb=0.85v v fb : fb input voltage. v en : en input voltage. pd should not be exceeded. downloaded from: http:///
6/28 datasheet d a t a s h e e t bd9e303efj-lb tsz02201-0j3j0aj00650-1-2 ? 2015 rohm co., ltd. all rights reserved. 13.feb.2015 rev.002 www.rohm.com tsz22111 ? 15 ? 001 typical performance curves figure 4. operating current vs junction temperature figure 5. stand-by current vs junction temperature figure 6. fb voltage reference vs junction temperature figure 7. fb input current vs junction temperature 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 -50-25 0 25 50 75100125150 temperature[c] operating current[ma] v in =7v v in =36v v in =24v v in =12v 0.0 2.0 4.0 6.0 8.0 10.0 -50 -25 0 25 50 75 100 125 150 temperature[c] stand by current[a] v in =7v v in =24v v in =12v v in =36v 0.98 0.99 1.00 1.01 1.02 -50-25 0 25 50 75100125150 temperature[c] voltage reference[v] v in =36v v in =24v v in =7v v in =12v -1.0 -0.8 -0.6 -0.4 -0.2 0.0 0.2 0.4 0.6 0.8 1.0 -50-250 255075100125150 temperature[c] fb input current[a] v in =24v v fb =1.1v downloaded from: http:///
7/28 datasheet d a t a s h e e t bd9e303efj-lb tsz02201-0j3j0aj00650-1-2 ? 2015 rohm co., ltd. all rights reserved. 13.feb.2015 rev.002 www.rohm.com tsz22111 ? 15 ? 001 typical performance curves - continued 0 50 100 150 200 -50-25 0 25 50 75100125150 temperature[c] low side mosfet on resistance[m ? ] 0 50 100 150 200 -50 -25 0 25 50 75 100 125 150 temperature[c] high side mosfet on resistance[m ? ] figure 8. switching frequency vs junction temperatur e figure 9. maximum duty vs junction temperature figure 10. high side mosfet on - resistance vs junction temperature figure 11. low side mosfet on -resistance vs junction temperature v in =24v v in =24v 250 260 270 280 290 300 310 320 330 -50 -25 0 25 50 75 100 125 150 temperature[c] switching frequency[khz] v in =12v v in =7v v in =24v v in =36v 93.0 93.5 94.0 94.5 95.0 95.5 96.0 -50-25 0 25 50 75100125150 temperature[c] maximum duty[%] v in =7v v in =36v v in =24v v in =12v downloaded from: http:///
8/28 datasheet d a t a s h e e t bd9e303efj-lb tsz02201-0j3j0aj00650-1-2 ? 2015 rohm co., ltd. all rights reserved. 13.feb.2015 rev.002 www.rohm.com tsz22111 ? 15 ? 001 figure 12. uvlo threshold vs junction temperature typical performance curves - continued 1.2 1.4 1.6 1.8 2.0 2.2 -50 -25 0 25 50 75 100 125 150 temperature[c] ven input voltage[v] v in sweep down v in sweep up figure 14. en threshold vs junction temperature en sweep up en sweep down figure 13. uvlo hysteresis vs junction temperature 1.1 1.2 1.3 1.4 1.5 1.6 1.7 -50 -25 0 25 50 75 100 125 150 temperature[c] uvlo hysteresis[v] 4.5 5.0 5.5 6.0 6.5 7.0 -50 -25 0 25 50 75 100 125 150 temperature[c] vin input voltage[v] v in sweep down v in sweep up en=3v figure 15. en input current vs junction temperature 2.0 3.0 4.0 5.0 6.0 7.0 8.0 -50 -25 0 25 50 75 100 125 150 temperature[c] en input current[a] en=3v downloaded from: http:///
9/28 datasheet d a t a s h e e t bd9e303efj-lb tsz02201-0j3j0aj00650-1-2 ? 2015 rohm co., ltd. all rights reserved. 13.feb.2015 rev.002 www.rohm.com tsz22111 ? 15 ? 001 typical performance curves - continued figure 16. soft start time vs junction temperature figure 17. efficiency vs output current (v out = 3.3v, l = 10h) 0 10 20 30 40 50 60 70 80 90 100 0.0 0.5 1.0 1.5 2.0 2.5 3.0 output current[a] efficiency[%] en = 3v v out = 3.3v v in = 24v v in = 7v v in = 12v v in = 36v figure 18. efficiency vs output current (v out = 5.0v, l = 10h) 0 10 20 30 40 50 60 70 80 90 100 0.0 0.5 1.0 1.5 2.0 2.5 3.0 output current[a] efficiency[%] en = 3v v out = 5.0v v in = 12v v in = 24v v in = 7v v in = 36v 1.0 1.5 2.0 2.5 3.0 3.5 4.0 -50 -25 0 25 50 75 100 125 150 temperature[c] soft start time[ms] v in =24v v in =7v downloaded from: http:///
10/28 datasheet d a t a s h e e t bd9e303efj-lb tsz02201-0j3j0aj00650-1-2 ? 2015 rohm co., ltd. all rights reserved. 13.feb.2015 rev.002 www.rohm.com tsz22111 ? 15 ? 001 typical performance curves - continued figure 19. power up (v in = en) (v out = 5.0v) figure 20. power down (v in = en) (v out = 5.0v) figure 21. power up (en = 0v 5v) (v out = 5.0v) figure 22. power down (en = 5v 0v) (v out = 5.0v) v in =20v/div en=20v/div v out =5v/div sw=20v/div v in =20v/div en=20v/div v out =5v/div sw=20v/div time=1ms/div time=1ms/div v in =20v/div en=5v/div v out =5v/div sw=20v/div v in =20v/div en=5v/div v out =5v/div sw=20v/div time=1ms/div time=1ms/div downloaded from: http:///
11/28 datasheet d a t a s h e e t bd9e303efj-lb tsz02201-0j3j0aj00650-1-2 ? 2015 rohm co., ltd. all rights reserved. 13.feb.2015 rev.002 www.rohm.com tsz22111 ? 15 ? 001 typical performance curves - continued figure 23. v out ripple (v in = 24v, v out = 5v, i out = 0a) figure 24. v out ripple (v in = 24v, v out = 5v, i out = 3a) figure 25. v in ripple (v in = 24v, v out = 5v, i out = 0a) figure 26. v in ripple (v in = 24v, v out = 5v, i out = 3a) sw=10v/div vout=20mv/div time=2 s/div sw=10v/div vout=20mv/div time=2 s/div v in =200mv/div sw=10v/div time=2 s / div v in =200mv/div sw=10v/div time=2 s/div downloaded from: http:///
12/28 datasheet d a t a s h e e t bd9e303efj-lb tsz02201-0j3j0aj00650-1-2 ? 2015 rohm co., ltd. all rights reserved. 13.feb.2015 rev.002 www.rohm.com tsz22111 ? 15 ? 001 typical performance curves - continued figure 27. switching waveform (v in = 12v, v out = 5v, i out = 3a) figure 28. switching waveform (v in = 24v, v out = 5v, i out = 3a) i l =1.0a/div sw=5v/div time=2 s/div i l =1.0a/div sw=10v/div time=2 s/div downloaded from: http:///
13/28 datasheet d a t a s h e e t bd9e303efj-lb tsz02201-0j3j0aj00650-1-2 ? 2015 rohm co., ltd. all rights reserved. 13.feb.2015 rev.002 www.rohm.com tsz22111 ? 15 ? 001 typical performance curves - continued figure 29. v out line regulation figure 30. v out line regulation -2.0 -1.5 -1.0 -0.5 0.0 0.5 1.0 1.5 2.0 6 9 12 15 18 21 24 27 30 33 36 vin input voltage[v] output voltage change[%] -2.0 -1.5 -1.0 -0.5 0.0 0.5 1.0 1.5 2.0 6 9 12 15 18 21 24 27 30 33 36 vin input voltage[v] output voltage change[%] i out =0a i out =3a i out =0a i out =3a figure 31. v out load regulation (v out = 3.3v) -2.0 -1.5 -1.0 -0.5 0.0 0.5 1.0 1.5 2.0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 output current[a] output voltage change[%] v in = 24v v out = 3.3v figure 32. v out load regulation (v out = 5.0v) -2.0 -1.5 -1.0 -0.5 0.0 0.5 1.0 1.5 2.0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 output current[a] output voltage change[%] v in = 24v v out = 5.0v v out = 3.3v v out = 5.0v downloaded from: http:///
14/28 datasheet d a t a s h e e t bd9e303efj-lb tsz02201-0j3j0aj00650-1-2 ? 2015 rohm co., ltd. all rights reserved. 13.feb.2015 rev.002 www.rohm.com tsz22111 ? 15 ? 001 typical performance curves C continued -80 -60 -40 -20 0 20 40 60 80 100 1k 10k 100k 1m frequency[hz] gain[db] -180 -135 -90 -45 0 45 90 135 180 phase[deg] -80 -60 -40 -20 0 20 40 60 80 100 1k 10k 100k 1m frequency[hz] gain[db] -180 -135 -90 -45 0 45 90 135 180 phase[deg] time=1ms/div time=1ms/div v out =200mv/div i out =1.0a/div v out =200mv/div i out =1.0a/div phase gain phase gain v in =12v v out =3.3v v in =24v v out =5v figure 35. load transient response i out =1a C 2a (v in =24v, v out =5v, c out =ceramic22 f2) figure 36. load transient response i out =1a C 3a (v in =24v, v out =5.0v, c out =ceramic22 f2) figure 33.closed loop response (v in =12v, v out =3.3v, i out =3a, c out =ceramic22 f2) figure 34. closed loop response (v in =24v, v out =5v, i out =3a, c out =ceramic22 f2) downloaded from: http:///
15/28 datasheet d a t a s h e e t bd9e303efj-lb tsz02201-0j3j0aj00650-1-2 ? 2015 rohm co., ltd. all rights reserved. 13.feb.2015 rev.002 www.rohm.com tsz22111 ? 15 ? 001 function description 1. enable control the ic shutdown can be controlled by the voltage applied to t he en terminal. when en voltage reaches 2.5v, the internal circuit is activated and the ic starts up. setting the shutdown interval (low level interval) of en to 100s or longer will enable the shutdown control with the en terminal. figure 37. timing chart with enable control 2. protective functions the protective circuits are intended for the prevention of damages caused by unexpected accidents. do not use them for continuous protective operation. (1) short circuit protection (scp) the short circuit protection block compares the fb terminal voltage with the internal reference voltage vref. when the fb terminal voltage has fallen below 0.7v (typ) and rema ined in that state for 1.0msec (typ), scp activates and stops the operation for 14msec (typ) an d subsequently initiates a restart. table 1. short circuit protection function en pin fb pin short circuit protection switching frequency 2.5v or higher 0.30v (typ) fb enabled 75khz (typ) 0.30v (typ)0.7v (typ) 300khz (typ) 0.8v or lower - disabled off figure 38. short circuit protection (scp) timing chart v en 0 v out 0 t ss v enh v enl en terminal output voltage tt v out 0.85 downloaded from: http:///
16/28 datasheet d a t a s h e e t bd9e303efj-lb tsz02201-0j3j0aj00650-1-2 ? 2015 rohm co., ltd. all rights reserved. 13.feb.2015 rev.002 www.rohm.com tsz22111 ? 15 ? 001 (2) under voltage lockout protection (uvlo) the under voltage lockout protection circuit monitors the vin terminal voltage. the operation enters standby when the vin te rminal voltage is 5.0v (typ) or lower. the operation starts when the vin terminal voltage is 6.4v (typ) or higher. figure 39. uvlo timing chart (3) thermal shutdown (tsd) when the chip temperature exceeds tj = 175 ? c, the dc/dc converter output is stopped. t he thermal shutdown circuit is intended for shutting down the ic from ther mal runaway in an abnormal state with the temperature exceeding tjmax = 150 ? c. it is not meant to protect or guarantee the soundness of the application. do not use the function of this circuit for application protection design. (4) over current protection (ocp) the over-current protection function observes the current flowing in upper-side mosfet by switching cycle and when it detects over flow current, it limits on duty and protects by dropping output voltage. (5) reverse curren t protection (rcp) the reverse-current protection function observes the current flowing in low-side mosfet and when it detects over flow current, it turns off the mosfet. (6) over voltage protection (ovp) over voltage protection function (ovp) compares fb terminal voltage with internal standard voltage vref. when the fb terminal voltage exceeds 1.30v (typ), it turns output mo sfets off. when output voltage drops until it reaches the hysteresis, it will return to normal operation. v in 0vv out high-side mosfet gate fb terminal soft start hys uvlo off uvlo on normal operation normal operation uvlo low-side mosfet gate downloaded from: http:///
17/28 datasheet d a t a s h e e t bd9e303efj-lb tsz02201-0j3j0aj00650-1-2 ? 2015 rohm co., ltd. all rights reserved. 13.feb.2015 rev.002 www.rohm.com tsz22111 ? 15 ? 001 application example figure 40. application circuit table 2. recommendation component valves v in 12v 24v v out 1.8v 3.3v 5v 3.3v 5v c in (n ote 3 ) 10 f 10 f 10 f 10 f 10 f c in1 0.1 f 0.1 f 0.1 f 0.1 f 0.1 f c boot 0.1 f 0.1 f 0.1 f 0.1 f 0.1 f l 4.7 h 10 h 10 h 10 h 10 h r1 12k ? 30k ? 30k ? 30k ? 30k ? r2 15k ? 13k ? 7.5k ? 13k ? 7.5k ? r3 5.6k ? 10k ? 15k ? 10k ? 15k ? c1 - - - - - c2 15000pf 10000pf 6800pf 10000pf 6800pf c out (note 4) ceramic 22 f2 ceramic 22 f2 ceramic 22 f2 ceramic 22 f2 ceramic 22 f2 (note 3) for capacitance of input capacitor, take temperatur e characteristics, dc bias characteristics, etc. into consideratio n to set minimum value to no less than 4.7 f. (note 4) in case capacitance value fluctuat es due to temperature characteristics, dc bi as characteristics, etc. of output capac itor, crossover frequency may fluctuate. when selecting a capacitor, confirm the characteristics of the capacitor in its datasheet. also, in order to reduce output ripple voltage, low esr capacitors such as ceramic type are recommended for output capacitor. boot v in en agnd sw pgnd comp fb v out v in c in c boot 1 2 3 4 7 6 5 8 c2 c1 c out r1 r2 r3 l downloaded from: http:///
18/28 datasheet d a t a s h e e t bd9e303efj-lb tsz02201-0j3j0aj00650-1-2 ? 2015 rohm co., ltd. all rights reserved. 13.feb.2015 rev.002 www.rohm.com tsz22111 ? 15 ? 001 selection of components externally connected parameters required to design a power supply are as follows. parameter unit value example input voltage v in 24 v output voltage v out 5 v switching frequency f osc 300khz(typ) inductor ripple current ? i l 1.3a esr of the output capacitor r esr 10m ? output capacitor c out 44 f soft-start time t ss 2.5ms(typ) max output current i omax 3a 1. switching frequency switching frequency is fixed to f osc = 300khz (typ). 2. output voltage set point the output voltage value can be set by the feedback resistance ratio. [v] . r r r v out minimum pulse range that can be produced at the output stably through all the load area is 200nsec for bd9e303efj-lb. use input/output condition which satisfies the following method. os c in out f v v nsec figure 41. feedback resistor circuit 3. input capacitor configuration for input capacitor, use a ceramic capacitor. for normal setting, 10 f is recommended, but with larger value, input ripple voltage can be further reduced. also, for capacitance of in put capacitor, take temperature characteristics, dc bias characteristics, etc. into consideration to set minimum value to no less than 4.7 f. 4. output lc filter the dc/dc converter requires an lc filter for smoothing the output voltage in order to supply a continuous current to the load. selecting an inductor with a large inductance causes the ripple current ? il that flows into the inductor to be small, decreasing the ripple voltage generated in the output voltage, but it is not advantageous in terms of the load transient response characteristic. selecting an inductor with a small inductance improves the transient response characteristic but causes the inductor ripple current to be large, which increases the ripple voltage in the output voltage, showing a trade-off relationship. here, select an inductance so that the size of t he ripple current component of t he inductor will be 20% to 50% of the max output current (3a). figure 42. waveform of current through inductor figure 43. output lc filter circuit i l t inductor saturation current > i outmax + ? i l /2 i outmax average inductor current ? i l vout l c out vin river downloaded from: http:///
19/28 datasheet d a t a s h e e t bd9e303efj-lb tsz02201-0j3j0aj00650-1-2 ? 2015 rohm co., ltd. all rights reserved. 13.feb.2015 rev.002 www.rohm.com tsz22111 ? 15 ? 001 now calculating with v in = 24v, v out = 5v, switching frequency f osc = 300khz, ? i l is1.3a, inductance value that can be used is calculated as follows: * if the output voltage setting is larger than half of v in please calculated as follows: also for saturation current of inductor, select the one with larger current than maximum output current added by 1/2 of inductor ripple current ? i l . output capacitor c out affects output ripple voltage charac teristics. select output capacitor c out so that necessary ripple voltage characteristics are satisfied. output ripple voltage can be expressed in the following method. f c r i v os c ou t es r l rp l with c out = 44f, r esr = 10m ? the output ripple voltage is calculated as . k m . v rp l [mv] * when selecting the value of the output capacitor c out , please note that the value of capacitor c load will add up to the value of c out to be connected to v out . charging current to flow through the c load , c out and the ic startup, must be complete d within the soft-start time this charge. over-current protection circuit operates when chargi ng is continued beyond the soft-start time, the ic may not start. please consider in the calculation the c ondition that the lower maximum value capacitor c load that can be connected to v out (max) is other than c out . inductor ripple current maximum value of start-up ( il start ) can be expressed in the following method. il start = output maximum load current(i omax ) + charging current to the output capacitor (i cap ) + ? i l 2 charging current to the output capacitor (i cap ) can be expressed in the following method. s s out loa d out ca p t v c c i from the above equation, v in = 24v, v out = 5v, l = 10 h, i omax = 3.0a (max), switching frequency f osc = 255khz (min), the output capacitor c out = 44 f, t ss = 1.25ms soft-start time (min), it becom es the following equation when calculating the maximum output load capacitance c load (max) that can be connected to v out . f] [ . c \ v t / i \ i \ . max c out out s s l oma x loa d inductor ripple current maximum value of start-up ( il start ) < over current protection threshold 4.25 [a](min) ?? h . i f v v \ v v l l os c i n ou t i n ou t P l os c i n i f v l downloaded from: http:///
20/28 datasheet d a t a s h e e t bd9e303efj-lb tsz02201-0j3j0aj00650-1-2 ? 2015 rohm co., ltd. all rights reserved. 13.feb.2015 rev.002 www.rohm.com tsz22111 ? 15 ? 001 5. phase compensation a current mode control buck dc/dc converter is a one-pole, one-zero system. the poles are formed by an error amplifier and the one load and the one zero point is added by t he phase compensation. the phase compensation resistor r cmp determines the crossover frequency f crs (15khz (typ)) where the total loop gain of the dc/dc converter is 0 db. the high value of this crossover frequency f crs provides a good load transient response characteristic but inferior stability. conversely, specifying a low value for the crossover frequency f crs greatly stabilizes the characteristics but the load transient response characteristic is impaired. (1) selection of phase compensation resistor r cmp the phase compensation resistance r cmp can be determined by using the following equation. ][ m a m p f b out cr s out cm p g g v c f v r (typ)) a/v (150 ctance transcondu amplifier error the is (typ)) (9a/v gain sense current the is (typ)) v (1.0 voltage reference feedback the is e capacitanc output the is the is voltage output the is : here frequency crossover ma mp fb out crs out g g v c f v w (2) selection of phase compensation capacitance c cmp for stable operation of the dc/dc converter, inserting a zero point under 1/9 of the zero crossover frequency cancels the phase delay due to the pole formed by the load often, thus, providing fa vorable characteristics. the phase compensation capacitance c cmp can be determined by using the following equation. z cm p cm p f r c ? [f] inserted point zero the is where f z * in case c cmp calculation result above exceeds 15000pf, set the value of compensation capacitance c cmp for use to15000pf. setting too large c cmp value may cause startup failure, etc. (3) loop stability in order to secure stability of dc/dc converter, conf irm there is enough phase margin on actual equipment. under the worst condition, it is recommended to secure phase margin more than 45. in practice, the characteristics may vary depending on pcb layout, routing of wiring, types of parts to use and operating environments (t emperature, etc.). use gain-phase analyzer or fra to confirm frequency charac teristics on actual equipment. contact the manufacturer of each measuring equipment to check its measuring method, etc. in case these measuring equipment are not available, there is a way to deduce phase margin degree from load response. monitor the fluctuation of out put voltage when unloaded condition is changed to maximum loaded condition. it can be said that responsiveness is low when fluctuation is sign ificant, and that phase margin degree is small when ringing is made many times after the condition change. normally, ringing is made 2 times or more as standard. however, this method cannot confi rm a quantitative phase margin degree. figure 44. load response inadequate phase margin adequate phase margin. load maximum load output voltage t 0 downloaded from: http:///
21/28 datasheet d a t a s h e e t bd9e303efj-lb tsz02201-0j3j0aj00650-1-2 ? 2015 rohm co., ltd. all rights reserved. 13.feb.2015 rev.002 www.rohm.com tsz22111 ? 15 ? 001 6. input voltage start-up figure 45. input voltage start-up time soft-start function is designed for the ic so that the output voltage will start according to the time it was decided internall y. after uvlo release, the output voltage range will be less than 80% of the input voltage at soft-start operation. please be sure that the input voltage of the so ft-start after startup is as follows. . . v v out in ? [v] 7. bootstrap capacitor bootstrap capacitor c boot shall be 0.1 f. connect a bootstrap capacitor between sw pin and boot pin. for capacitance of bootstrap capacitor, take temperature characte ristics, dc bias characteristi cs, etc. into consideration to set minimum value to no less than 0.047 f. downloaded from: http:///
22/28 datasheet d a t a s h e e t bd9e303efj-lb tsz02201-0j3j0aj00650-1-2 ? 2015 rohm co., ltd. all rights reserved. 13.feb.2015 rev.002 www.rohm.com tsz22111 ? 15 ? 001 pcb layout design in buck dc/dc converters, a large pulsed current flows in two loops. the first loop is the one into which the current flows when the high side fet is turned on. the flow starts from the input capacitor c in , runs through the fet, inductor l and output capacitor c out and back to ground of c in via ground of c out . the second loop is the one into which the current flows when the low side fet is turned on. the flow starts from the low side fet, runs through the inductor l and output capacitor c out and back to ground of the low side fet via ground of c out . tracing these two loops as thick and short as possible allows noise to be reduced for improved efficiency. it is recommended to connect the input and output capacitors, in particular, to the ground plane. the pcb layout has a great influence on the dc/dc converter in terms of all of the heat generation, noise and efficiency characteristics. accordingly, design the pcb layout with par ticular attention paid to the following points. ? provide the input capacitor as close to the vi n terminal as possible on the same plane as the ic. ? if there is any unused area on the pcb, provide a copper fo il plane for the ground node to assist in heat dissipation from the ic and the surrounding components. ? switching nodes such as sw are susceptible to noise due to ac coupling with other nodes. trace to the inductor as thick and as short as possible. ? provide lines connected to fb and comp as far as possible from the sw node. ? provide the output capacitor away from the input capacitor in order to avoid the effect of harmonic noise from the input. figure 46. current loop of buck converter figure 47. example of sample board layout pattern l c in c out c boot c2 r3 vout sw vin gnd en r1 r2 top layer bottom layer i i downloaded from: http:///
23/28 datasheet d a t a s h e e t bd9e303efj-lb tsz02201-0j3j0aj00650-1-2 ? 2015 rohm co., ltd. all rights reserved. 13.feb.2015 rev.002 www.rohm.com tsz22111 ? 15 ? 001 power dissipation take into careful consideration that the power dissipation is within the allowable dissipation curve to design the pcb layout and peripheral circuits. htsop-j8 mounting on rohm standard board based on jedec. board specification: fr4 (glass-ep oxy), 114.3mm 76.2 mm 1.6 mm copper foil on the front side: rohm recommended land pattern + wiring to measure. pcb: 4-layer pcb (copper foil area on 2nd & 3rd layer and reverse side, 74.2 mm 74.2 mm) copper foil thickness: front side and reverse side 70m be used, 2nd & 3rd 35m be used. condition: ja = 45.2 c / w i/o equivalence circuit(s) 1. boot 8. sw 3. en 5. fb 6. comp figure 49. i/o equivalent circuit chart figure 48. power dissipation (htsop-j8) bootreg pgnd boot sw reg v in 3.0 4.0 temperature:ta [c] 1.0 2.0 0 0 25 50 75 100 125 150 2.76w power dissipation:pd [w] downloaded from: http:///
24/28 datasheet d a t a s h e e t bd9e303efj-lb tsz02201-0j3j0aj00650-1-2 ? 2015 rohm co., ltd. all rights reserved. 13.feb.2015 rev.002 www.rohm.com tsz22111 ? 15 ? 001 operational notes 1. reverse connection of power supply connecting the power supply in reverse polarity can damage the ic. take precautions against reverse polarity when connecting the power supply, such as mounting an external diode between the power supply and the ics power supply pins. 2. power supply lines design the pcb layout pattern to provide low impedance s upply lines. separate the ground and supply lines of the digital and analog blocks to prevent noise in the ground and supply lines of the digital bl ock from affecting the analog block. furthermore, connect a capacitor to ground at all po wer supply pins. consider t he effect of temperature and aging on the capacitance value when using electrolytic capacitors. 3. ground voltage ensure that no pins are at a voltage below that of t he ground pin at any time, even during transient condition. 4. ground wiring pattern when using both small-signal and large-current ground traces , the two ground traces should be routed separately but connected to a single ground at the refer ence point of the application board to av oid fluctuations in the small-signal ground caused by large currents. also ensure that the grou nd traces of external components do not cause variations on the ground voltage. the ground lines must be as s hort and thick as possible to reduce line impedance. 5. thermal consideration should by any chance the power dissipation rating be exceed ed the rise in temperature of the chip may result in deterioration of the properties of the chip. in case of exceeding this abs olute maximum rating, increase the board size and copper area to prevent exceeding the pd rating. 6. recommended operating conditions these conditions represent a range within which the expected characteristics of the ic can be approximately obtained. the electrical characteristics are guaranteed under the conditions of each parameter. 7. inrush current when power is first supplied to the ic, it is possible that th e internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays, especially if the ic has more than one power supply. therefore, give special consider ation to power coupling capacitance, power wiring, width of ground wiring, and routing of connections. 8. operation under strong electromagnetic field operating the ic in the presence of a strong electromagnetic field may cause the ic to malfunction. 9. testing on application boards when testing the ic on an application board, connecting a capacitor directly to a low-impedance output pin may subject the ic to stress. always discharge capacitors comp letely after each process or step. the ics power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. to prevent damage from static discharge, ground the ic during assembly and use similar precautions during transport and storage. 10. inter-pin short and mounting errors ensure that the direction and position are correct when mounting the ic on the pc b. incorrect mounting may result in damaging the ic. avoid nearby pins being shorted to each ot her especially to ground, power supply and output pin. inter-pin shorts could be due to many reasons such as meta l particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few. 11. unused input pins input pins of an ic are often connected to the gate of a mos transis tor. the gate has extremely high impedance and extremely low capacitance. if left unconnected, the electric fi eld from the outside can easily charge it. the small charge acquired in this way is enough to produce a significant effect on the conduction thr ough the transistor and cause unexpected operation of the ic. so unless otherwise specif ied, unused input pins should be connected to the power supply or ground line. downloaded from: http:///
25/28 datasheet d a t a s h e e t bd9e303efj-lb tsz02201-0j3j0aj00650-1-2 ? 2015 rohm co., ltd. all rights reserved. 13.feb.2015 rev.002 www.rohm.com tsz22111 ? 15 ? 001 operational notes C continued 12. regarding the input pin of the ic this monolithic ic contains p+ isolation and p substrat e layers between adjacent elements in order to keep them isolated. p-n junctions are formed at the intersection of the p layers with the n layers of other elements, creating a parasitic diode or transistor. for example (refer to figure below): when gnd > pin a and gnd > pin b, the p-n j unction operates as a parasitic diode. when gnd > pin b, the p-n junction operates as a parasitic transistor. parasitic diodes inevitably occur in the structure of the ic. the operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physical dam age. therefore, conditions that cause these diodes to operate, such as applying a voltage lower than the gnd voltage to an input pin (and thus to the p substrate) should be avoided. figure 50. example of monolithic ic structure 13. ceramic capacitor when using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with temperature and the decrease in nominal capacitance due to dc bias and others. 14. area of safe operation (aso) operate the ic such that the output voltage, output current, and power dissipation are all within the area of safe operation (aso). 15. thermal shutdown circuit(tsd) this ic has a built-in thermal shutdown circuit that prev ents heat damage to the ic. normal operation should always be within the ics power dissipation rating. if however the rating is exceeded for a continued period, the junction temperature (tj) will rise which will activate the tsd circui t that will turn off all output pins. when the tj falls below the tsd threshold, the circuits are automatically restored to normal operation. note that the tsd circuit operates in a situation that exceeds the absolut e maximum ratings and therefore, under no circumstances, should the tsd circuit be used in a set design or for any purpose other t han protecting the ic from heat damage. 16. over current protection circuit (ocp) this ic incorporates an integrated over current protection circuit that is acti vated when the load is shorted. this protection circuit is effective in preventing damage due to sudden and unexpected incidents. however, the ic should not be used in applications characterized by continuous operation or transit ioning of the protection circuit. downloaded from: http:///
26/28 datasheet d a t a s h e e t bd9e303efj-lb tsz02201-0j3j0aj00650-1-2 ? 2015 rohm co., ltd. all rights reserved. 13.feb.2015 rev.002 www.rohm.com tsz22111 ? 15 ? 001 ordering information b d 9 e 3 0 3 e f j - l b h 2 part number package efj: htsop-j8 product class lb: for industrial applications packaging and forming specification h2: embossed tape and 18cm reel (quantity : 250pcs) b d 9 e 3 0 3 e f j - l b e 2 part number package efj: htsop-j8 product class lb: for industrial applications packaging and forming specification e2: embossed tape and 32.8cm reel (quantity : 2500pcs) marking diagrams htsop-j8 (top view) d9e303 part number marking lot number 1pin mark downloaded from: http:///
27/28 datasheet d a t a s h e e t bd9e303efj-lb tsz02201-0j3j0aj00650-1-2 ? 2015 rohm co., ltd. all rights reserved. 13.feb.2015 rev.002 www.rohm.com tsz22111 ? 15 ? 001 physical dimension, tape and reel information C continued package name htsop-j8 downloaded from: http:///
28/28 datasheet d a t a s h e e t bd9e303efj-lb tsz02201-0j3j0aj00650-1-2 ? 2015 rohm co., ltd. all rights reserved. 13.feb.2015 rev.002 www.rohm.com tsz22111 ? 15 ? 001 revision history date revision changes 13.feb.2015 002 new release downloaded from: http:///
datasheet d a t a s h e e t notice-ss rev.004 ? 2013 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. if you intend to use our products in devices requiring extremely high reliability (such as medical equipment (note 1) , aircraft/spacecraft, nuclear power controllers, etc.) and whos e malfunction or failure may cause loss of human life, bodily injury or serious damage to property (specific applications), please consult with the rohm sales representative in advance. unless otherwise agreed in writ ing by rohm in advance, rohm shall not be in any way responsible or liable for any damages, expenses or losses in curred by you or third parties arising from the use of any rohms products for specific applications. (note1) medical equipment classification of the specific applications japan usa eu china class class class b class class ? class 2. rohm designs and manufactures its products subject to strict quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe desi gn against the physical injury, damage to any property, which a failure or malfunction of our products may cause. the following are examples of safety measures: [a] installation of protection circuits or other protective devices to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our products are not designed under any special or extr aordinary environments or conditi ons, as exemplified below. accordingly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any rohms products under an y special or extraordinary environments or conditions. if you intend to use our products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] use of our products in any types of liquid, incl uding water, oils, chemicals, and organic solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products ar e exposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed to static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing components, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (ev en if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4. the products are not subjec t to radiation-proof design. 5. please verify and confirm characteristics of the final or mounted products in using the products. 6. in particular, if a transient load (a large amount of load applied in a short per iod of time, such as pulse. is applied, confirmation of performance characteristics after on-boar d mounting is strongly recomm ended. avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading c ondition may negatively affect product performance and reliability. 7. de-rate power dissipation (pd) depending on ambient temper ature (ta). when used in seal ed area, confirm the actual ambient temperature. 8. confirm that operation temperat ure is within the specified range described in the product specification. 9. rohm shall not be in any way responsible or liable for fa ilure induced under deviant condi tion from what is defined in this document. precaution for mounting / circuit board design 1. when a highly active halogenous (chlori ne, bromine, etc.) flux is used, the resi due of flux may negatively affect product performance and reliability. 2. in principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must be used on a through hole mount products. if the flow sol dering method is preferred on a surface-mount products, please consult with the rohm representative in advance. for details, please refer to rohm mounting specification downloaded from: http:///
datasheet d a t a s h e e t notice-ss rev.004 ? 2013 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, pl ease allow a sufficient margin considering variations of the characteristics of the products and external components, including transient characteri stics, as well as static characteristics. 2. you agree that application notes, re ference designs, and associated data and in formation contained in this document are presented only as guidance for products use. theref ore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take proper caution in your manufacturing process and storage so that voltage exceeding t he products maximum rating will not be applied to products. please take special care under dry condit ion (e.g. grounding of human body / equipment / solder iron, isolation from charged objects, se tting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connections may deteriora te if the products are stor ed in the places where: [a] the products are exposed to sea winds or corros ive gases, including cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to di rect sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage c ondition, solderability of products out of recommended storage time period may be degraded. it is strongly recommended to confirm sol derability before using products of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the co rrect direction, which is indicated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. use products within the specified time after opening a humidity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage time period. precaution for product label qr code printed on rohm products label is for rohms internal use only. precaution for disposition when disposing products please dispose them proper ly using an authorized industry waste company. precaution for foreign exchange and foreign trade act since our products might fall under cont rolled goods prescribed by the applicable foreign exchange and foreign trade act, please consult with rohm representative in case of export. precaution regarding intellectual property rights 1. all information and data including but not limited to application example contained in this document is for reference only. rohm does not warrant that foregoi ng information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. rohm shall not be in any way responsible or liable for infringement of any intellectual property rights or ot her damages arising from use of such information or data.: 2. no license, expressly or implied, is granted hereby under any intellectual property rights or other rights of rohm or any third parties with respect to the information contained in this document. other precaution 1. this document may not be reprinted or reproduced, in whol e or in part, without prior written consent of rohm. 2. the products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 3. in no event shall you use in any wa y whatsoever the products and the related technical information contained in the products or this document for any military purposes, incl uding but not limited to, the development of mass-destruction weapons. 4. the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties. downloaded from: http:///
datasheet datasheet notice C we rev.001 ? 201 5 rohm co., ltd. all rights reserved. general precaution 1. before you use our pro ducts, you are requested to care fully read this document and fully understand its contents. rohm shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny rohms products against warning, caution or note contained in this document. 2. all information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. before purchasing or using rohms products, please confirm the la test information with a rohm sale s representative. 3. the information contained in this doc ument is provi ded on an as is basis and rohm does not warrant that all information contained in this document is accurate an d/or error-free. rohm shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. downloaded from: http:///

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